KOCH CHEMIE MICRO CUT PAD

KOCH CHEMIE MICRO CUT PAD

A high-quality polishing sponge designed for removing fine scratches, holograms, and polishing marks when used with Micro...
$23.03
$23.03
Please hurry! Only 0 left in stock
SIZE: 5"
Subtotal: $23.03
KOCH CHEMIE MICRO CUT PAD

KOCH CHEMIE MICRO CUT PAD

$23.03
KOCH CHEMIE MICRO CUT PAD

KOCH CHEMIE MICRO CUT PAD

$23.03
SIZE: 5"
Description
Description
x

A high-quality polishing sponge designed for removing fine scratches, holograms, and polishing marks when used with Micro Cut M3.02 or Micro Cut & Finish P3.01. Its low 23 mm height reduces torsion forces, providing excellent handling and maximum stability. The specially engineered foam density ensures long-lasting compression hardness during polishing. Optimized open-cell structure and cell count deliver a high-gloss finish while maintaining excellent hygiene. The milling edge adds flexibility, allowing the pad to easily conform to contours, and the colorful non-woven polishing surface ensures safe, reliable results.

Compression hardness: 10
Abrasiveness: 5

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